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Precision Polishing Machine Product List and Ranking from 5 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

Precision Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. null/null
  2. ムサシノ電子 Tokyo//Industrial Machinery
  3. null/null
  4. 4 イマハシ製作所 Tokyo//Industrial Machinery 東京営業所
  5. 4 null/null
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Precision Polishing Machine Product ranking

Last Updated： Aggregation Period:Jul 16, 2025～Aug 12, 2025
This ranking is based on the number of page views on our site.

  1. Small Precision Grinding Machine "DIA-LAP ACE" [Made in Japan]
  2. OTEC / Precision Polishing Device "Drag Finish Machine"
  3. Tabletop Precision Grinding Device "ALP-250 Model" イマハシ製作所 東京営業所
  4. Tabletop Precision Grinding Machine "DIALAP" [Made in Japan]
  5. Precision Grinding Machine 'IS-POLISHER ISPP-1000'

Precision Polishing Machine Product List

1～15 item / All 27 items

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Tabletop Precision Grinding Device "ALP-250 Model"

Tabletop Precision Grinding Device "ALP-250 Model"

High precision and high rigidity frame structure with a tabletop machine! Achieved the creation of high-precision polished samples.

The "ALP-250 model" is a polishing device designed and created to produce observation surfaces for various analyses and evaluations, including semiconductor devices, MEMS devices, automotive parts, metals, coatings, resins, and ceramics. With its high-precision and highly rigid frame structure, this tabletop machine enables the creation of high-precision polished samples. It can safely operate at high rotational speeds of 200 rpm, allowing for free polishing in a short amount of time. 【Features】 ■ Designed and created to produce observation surfaces for various analyses and evaluations ■ Capable of three-station roller arms, allowing for a certain degree of mass production ■ Usable without jigs, can also be operated as a handheld lap ■ Can safely operate at high rotational speeds of 200 rpm, enabling free polishing in a short time *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Precision grinding device

Precision grinding device

Polishing high-hardness metals with micrometer precision! Minimizing the environmental dispersion of polishing debris as much as possible.

Aro Trust Co., Ltd. handles "precision grinding machines." Our products can grind with an accuracy of ±0.01 to ±0.1. They can also grind high-hardness tungsten ore. To ensure optimal grinding conditions, we propose and manufacture each machine tailored to the shape of the item being ground. 【Features】 ■ Grinds high-hardness metals with micrometer precision ■ Capable of grinding high-hardness tungsten ore ■ Grinding accuracy of ±0.01 to ±0.1 ■ Maximum grinding stroke of 20mm ■ Standard maximum grinding size is 30mm in width, 20mm in depth, and 50mm in height *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Precision Grinding Device "MA-400e"

Precision Grinding Device "MA-400e"

High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-300e"

Precision Grinding Device "MA-300e"

Interlock covers are also available! We have achieved further efficiency in polishing operations.

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200e"

Precision Grinding Device "MA-200e"

Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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