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Precision Polishing Machine Product List and Ranking from 15 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

Precision Polishing Machine Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. ムサシノ電子 Tokyo//Industrial Machinery
  2. アイエムティー Wakayama//Testing, Analysis and Measurement
  3. シーケービー Tokyo//Trading company/Wholesale
  4. 4 パルメソ Niigata//Testing, Analysis and Measurement
  5. 5 null/null
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Precision Polishing Machine Product ranking

Last Updated： Aggregation Period:Sep 03, 2025～Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. OTEC / Precision Polishing Device "Drag Finish Machine" シーケービー
  2. Precision Grinding Device "MA-200e" ムサシノ電子
  3. "Pre-processing machine for research and development" Ultra-precision polishing device 'PERET' パルメソ
  4. 4 Does not damage IC chips! Desktop precision grinding device 'AP-1000' 三友製作所 テクノセンタ
  5. 5 [Column] Episode 2 Part 1 - Solve the Drainage Problem - アイエムティー

Precision Polishing Machine Product List

1～15 item / All 31 items

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TDC Corporation Company Profile

TDC Corporation Company Profile

We realize ultra-precision manufacturing with our unique ultra-precision/wrapping processing technology!

At TDC Corporation, we base our operations on ultra-precision mirror finishing technology, enabling us to achieve sub-nanometer level surface roughness, sub-micron level flatness, parallelism, and dimensional accuracy. Not only do we realize individual precision, but we also excel in achieving complex precision. We accept polishing of not just flat surfaces, but also curved surfaces, spherical surfaces, and both inner and outer diameters. In addition to precise polishing, we are also skilled in general machining processes such as "cutting," "grinding," and "shape processing." With our comprehensive processing equipment and years of accumulated know-how, we are ready to respond to your overall manufacturing inquiries. 【Processing Technologies】 ■ Ultra-precision polishing / Lapping ■ Cutting / Grinding *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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OTEC / Precision Polishing Device "Drag Finish Machine"

OTEC / Precision Polishing Device "Drag Finish Machine"

Compact and economical! It is widely used in the tool manufacturing and medical fields.

The DF series features a three-axis drive system. It is a device capable of precision polishing, from improving surface roughness (coarse and medium grinding) to finishing polishing (mirror finish), in a very short processing time. The workpiece is mounted on a rotating holder (rotation), which is fixed to a driven holder that rotates multiple pieces together (revolution). Furthermore, this unit is attached to multiple main rotating rotors and rotates (revolution). In other words, the workpiece is polished while being submerged and pressed against the polishing abrasive, undergoing a complex combination of self-rotation and revolution in three axes.

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  • DF-image.jpg
  • 補足画像-A-1-Applications-1024x792.jpg
  • 補足画像-A-2-Tool-Holders.jpg
  • Other processing machines

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Tabletop Precision Grinding Device "ALP-250 Model"

Tabletop Precision Grinding Device "ALP-250 Model"

High precision and high rigidity frame structure with a tabletop machine! Achieved the creation of high-precision polished samples.

The "ALP-250 model" is a polishing device designed and created to produce observation surfaces for various analyses and evaluations, including semiconductor devices, MEMS devices, automotive parts, metals, coatings, resins, and ceramics. With its high-precision and highly rigid frame structure, this tabletop machine enables the creation of high-precision polished samples. It can safely operate at high rotational speeds of 200 rpm, allowing for free polishing in a short amount of time. 【Features】 ■ Designed and created to produce observation surfaces for various analyses and evaluations ■ Capable of three-station roller arms, allowing for a certain degree of mass production ■ Usable without jigs, can also be operated as a handheld lap ■ Can safely operate at high rotational speeds of 200 rpm, enabling free polishing in a short time *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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Does not damage IC chips! Desktop precision grinding device 'AP-1000'

Does not damage IC chips! Desktop precision grinding device 'AP-1000'

[Must-see for the semiconductor industry] Check chips more accurately! Inspection possible without damaging integrated circuits using high-precision polishing technology!

The "AP-1000" is a tabletop precision polishing device equipped with a high-precision 6-axis stage. Processing can be done simply by specifying the processing range of the sample on the GUI. There is no need for troublesome height adjustments. It can be used for package local unsealing processes and local substrate thinning processes. 【Features】 ■ Equipped with a high-precision 6-axis stage ■ Auto-leveling function ■ Load detection mechanism ■ Recipe registration function (up to 256 recipes) *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment

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[Column] Episode 2 Part 1 - Solve the Drainage Problem -

[Column] Episode 2 Part 1 - Solve the Drainage Problem -

~Me, Polishing, and IMT~

My company needed improvement... After I had gotten a bit used to the work, my boss presented a new challenge: "I want to do something about the drainage." I contacted IMT, and a salesperson came right away. As always, he greeted me with a refreshing smile, but I felt a bit nervous. "I need to pull myself together," I thought, switching my mindset back to work. When I asked, "How do other companies handle drainage?" I received an explanation that included examples from other companies. I can't say it out loud, but our company's drainage treatment is not good... It's bad. We have to improve somehow. Recently, there has been a need to address SDGs, and I was told that there are many questions like mine. They mentioned that there is a suitable product and introduced me to it. It's the "RYUZIN Filtration System." [To be continued in the next part]

  • Wafer processing/polishing equipment

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Abiko Research Institute Product Line

Abiko Research Institute Product Line

We offer ultra-precision machinery technology! We have a wide range of high-quality products tailored to meet our customers' needs.

At Abiko Research Institute, we provide ultra-precision machinery technology, including ultra-precision machines with a resolution of 10 nanometers and a rotation accuracy of 40 nanometers, as well as automatic polishing equipment for single crystal diamonds. We offer a versatile diamond polishing machine "ND-10" that can be operated by inexperienced users, along with a micro ball polishing machine "MB-20" and "Zero Table" in our lineup. 【Features (Versatile Diamond Polishing Machine)】 ■ Ultra-precision polishing of single crystal diamonds, PCD, and CBN ■ Usable by inexperienced operators ■ Supports various polishing directions ■ Automatic polishing of diamonds *For more details, please refer to the PDF materials or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-400e"

Precision Grinding Device "MA-400e"

High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.

The "MA-400e" is a precision grinding device with a spindle directly mounted on a surface plate that has been ground and finished with high precision. The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. By combining the automatic grinding mechanism's roller holding unit, roller-type swinging holding unit, and various sample holders, we have achieved high-precision automatic grinding for electronic materials, electronic components, ceramics, metal materials, as well as for the pretreatment of TEM, SEM, SIMS samples, and orientation using X-rays. 【Features】 - The spindle is directly mounted on a surface plate that has been ground and finished with high precision. - High-precision angular bearings are used in the spindle. - Achieves flatness accuracy within ±10μm on the reference table. - The brushless DC motor allows for high-precision grinding as there is no change in rotational speed due to load fluctuations. *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-300e"

Precision Grinding Device "MA-300e"

Interlock covers are also available! We have achieved further efficiency in polishing operations.

The "MA-300e" is a precision polishing device suitable for polishing large samples such as 3-inch and 4-inch specimens. By installing automatic sample holding units in three locations, it achieves further efficiency in polishing operations. Additionally, by equipping a shaking device, it is expected to improve polishing accuracy and maintain the flatness of the polishing disc. It adopts a sequence control program, allowing for centralized management of the polishing process recipes. 【Features】 - Suitable for polishing large samples such as 3-inch and 4-inch specimens - Three automatic sample holding units installed for further efficiency in polishing operations - Adopts a sequence control program for centralized management of polishing process recipes - Equipped with a leakage breaker and emergency stop button for safe and secure polishing operations - Interlock cover also available *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
  • Other processing machines

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Precision Grinding Device "MA-200e"

Precision Grinding Device "MA-200e"

Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.

The "MA-200e" is a precision grinding device that is highly accurate and suitable for sample preparation in research and development. With the emergency stop button, leakage breaker, and interlock cover (optional), it enables grinding operations with a focus on safety and security. Additionally, it is now possible to manage a wide variety of grinding processes and recipes collectively via a touch panel. 【Features】 ■ Highly accurate and suitable for sample preparation in research and development ■ Improved drive system and rigidity successfully reduce vibration and noise significantly ■ Comfortable operation with digital control using an LCD touch panel ■ Ability to collectively manage a wide variety of grinding processes and recipes via the touch panel ■ Enables grinding operations with a focus on safety and security *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer processing/polishing equipment
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Mechatronics in the field of engineering

Mechatronics in the field of engineering

Introducing polishing (lapping) processing technology with nanometer precision through load control!

Hitachi Information and Communication Engineering collaborates with customers to design and develop dedicated equipment tailored to their needs, proposing solutions that integrate IT data. Focusing on load control technology, we possess various technologies such as positioning technology, measurement technology, and control technology (software), enabling polishing (lapping) with nanometer precision. Our production equipment-related products mainly handle storage-related production equipment, such as hard disk drives and optical discs. Utilizing the technologies and know-how accumulated within this field, we are expanding our range of equipment products for various applications. 【Features】 ■ High-precision polishing technology (load control technology) ■ Production equipment-related products ■ Micro-component handling technology ■ Precision tool manufacturing technology *For more details, please refer to the PDF document or feel free to contact us.

  • Other contract services

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